Project report for Thermal Metal Paste

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Thermal interfaces are commonly known to provide efficient heat management solutions required for improving the system's overall performance and lifespan. In India Various products of thermal interfaces available in the market include greases, thermal tapes, elastomeric pads, and solders. Thermal interface material selection criteria are based on mechanical factors, electrical insulation, quality, thermal resistance, performance, and material compatibility. The product is anticipated to witness significant gains owing to its thermal conductivity nature which helps in strengthening the life and efficiency of the electronic device or the equipment where it finds its application. The product is usually made of conducting materials like silicone, metal oxides, or metals.

Thermal paste is a thermally conductive chemical compound, which is commonly used as an interface between heat sinks and heat sources such as high-power semiconductor devices. The main role of thermal paste is to eliminate air gaps or spaces from the interface area in order to maximize heat transfer and dissipation. Thermal paste is an example of a thermal interface material. As opposed to thermal adhesive, thermal paste does not add mechanical strength to the bond between heat source and heat sink. It has to be coupled with a mechanical fixation mechanism such as screws to hold the heat sink in place and to apply pressure, spreading the thermal paste.

Market potential & Strategy

The global thermal interface materials market size was valued at INR 1350 Crores in 2019 and is expected to grow at a compound annual growth rate (CAGR) of 11.0% from 2020 to 2027. Growing consumer reliance on electronic items like smartphones, tablets, the advent of the automotive industry in developing economies, and the growing affluence of the middle-class population is expected to project a higher demand for the product among manufacturers across regions. Thermal interface materials are applied between two hard surfaces for conducting heat and find its usage at times of greater demand for modern electronic devices. Commercial availability of different thermal interface materials in an array of forms coupled with growing applications in the electronic industry is anticipated to increase the penetration over the coming years.

The increasing demand for miniaturization and automation of electronic devices, such as mobile devices, touch screens & displays, and medical devices is a driving factor for the growth of the TIMs. As electronics become smaller, they heat up easily as the components are more concentrated. This increases heat density over the surface of the electronic equipment. TIMs are needed to increase heat dissipation. The growing demand for these electronic products globally has led to an increase in the consumption of TIMs in the electronics industry. The TIMs market has suffered reduction in demand, it has lasted for short time as compared to other major industries. Increasing use of teleconferencing, remote working technologies shows growth in the telecom sector. Sale of computers, laptops, video games, and smartphones has gone up as companies are switching to work from home policy. The demand for consumer durables has increased as people staying in home require individual consumer electronics for personal use.

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